发明名称 CURED EPOXY RESIN PRODUCT AND CURING METHOD FOR OBTAINING SAME
摘要 PROBLEM TO BE SOLVED: To obtain a cured product by heating a composition which contains a microencapsulated curing or cure-accelerating agent prepared by surrounding the agent with a wall film based on a polymer having specified structural units and an epoxy resin and has improved storage stability and durability. SOLUTION: An oil phase obtained by dissolving a normally liquid curing or cure-accelerating agent in a polyisocyanate is dispersed in a water phase to obtain an O/W emulsion containing oil drops having a particle diameter of 0.05-500μm. A polyamine having at least two amino groups in the molecule is added to and dissolved in the water phase of this emulsion to effect interfacial polymerization to obtain a microencapsulated curing or cure-accelerating agent composed of the agent surrounded with a wall film based on a polymer having structural units of the formula (wherein R1 and R2 are each H or a monovalent organic group). A composition prepared by adding 1-80 pts.wt. microencapsulated curing or cure-accelerating agent to 100 pts.wt. epoxy resin is heated to 80-150 deg.C.
申请公布号 JPH11193344(A) 申请公布日期 1999.07.21
申请号 JP19980291232 申请日期 1998.10.14
申请人 NITTO DENKO CORP 发明人 HOSOKAWA TOSHITSUGU;MATSUSHITA TOMOKO;HATA MASAHIRO
分类号 B01J13/16;C08G18/32;C08G59/40;C08L75/02;C08L79/00;(IPC1-7):C08L79/00 主分类号 B01J13/16
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