发明名称 |
CURED EPOXY RESIN PRODUCT AND CURING METHOD FOR OBTAINING SAME |
摘要 |
PROBLEM TO BE SOLVED: To obtain a cured product by heating a composition which contains a microencapsulated curing or cure-accelerating agent prepared by surrounding the agent with a wall film based on a polymer having specified structural units and an epoxy resin and has improved storage stability and durability. SOLUTION: An oil phase obtained by dissolving a normally liquid curing or cure-accelerating agent in a polyisocyanate is dispersed in a water phase to obtain an O/W emulsion containing oil drops having a particle diameter of 0.05-500μm. A polyamine having at least two amino groups in the molecule is added to and dissolved in the water phase of this emulsion to effect interfacial polymerization to obtain a microencapsulated curing or cure-accelerating agent composed of the agent surrounded with a wall film based on a polymer having structural units of the formula (wherein R1 and R2 are each H or a monovalent organic group). A composition prepared by adding 1-80 pts.wt. microencapsulated curing or cure-accelerating agent to 100 pts.wt. epoxy resin is heated to 80-150 deg.C. |
申请公布号 |
JPH11193344(A) |
申请公布日期 |
1999.07.21 |
申请号 |
JP19980291232 |
申请日期 |
1998.10.14 |
申请人 |
NITTO DENKO CORP |
发明人 |
HOSOKAWA TOSHITSUGU;MATSUSHITA TOMOKO;HATA MASAHIRO |
分类号 |
B01J13/16;C08G18/32;C08G59/40;C08L75/02;C08L79/00;(IPC1-7):C08L79/00 |
主分类号 |
B01J13/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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