| 摘要 |
A lead frame, method of making same and semiconductor package containing the lead frame. The semiconductor package includes the lead frame which includes an essentially flat, planar lead frame body and lead frame leads extending from the lead frame body, the lead frame leads extending partially out of the plane of the lead frame body. A semiconductor chip is disposed on the lead frame and an encapsulant encapsulates the lead frame body, the semiconductor chip and a portion of the lead frame leads, with a portion of the lead frame leads extending external to the encapsulant. The two dimensional cross section can be essentially in the shape of a "U", essentially sinusoidal in shape, the sinusoidal shape having an odd number of half cycles of the sinusoidal shape or essentially in the shape of a "W".
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