| 摘要 |
FIELD: electronics, formation of three-dimensional modules with case-free volumetric and film electron components. SUBSTANCE: intermediate multifunctional plates are positioned among self- dependent electron components made on base of crystals of integrated circuits and microplates carrying active and passive electron components. All composite parts of module are fabricated predominantly from heat conducting materials and make up effective heat removing system together with elements of intermodule heat removal. Microplates and intermediate plates additionally include film active and passive components manufactured according to semiconductor, thin- and thick-film technologies which considerably enhances functional capabilities of equipment. There are proposed versions of economically effective assembly of module by way of capillary soldering or with use of elastic elements. EFFECT: increased density of packing of module, reduced volume and mass of electronic equipment, its enhanced reliability and noise immunity, provision for its normal operation under hard functional conditions without considerable labor input to its manufacture. 18 cl, 20 dwg |
