| 摘要 |
An automated system is presented for containerless transfer of semiconductor wafers through a wall separating a first fabrication area and a second fabrication area. The system includes multiple containers for transporting the wafers, one or more air lock chambers, mass transfer systems, robotic arms, stock areas, and a control system. The containers (e.g., wafer boats) are dispersed between the first and second fabrication areas. A portion of the containers contain at least one semiconductor wafer, and the remainder of the containers are empty. The air lock chambers are positioned in sealed openings in the wall. The air lock chambers provide isolation between the first and second fabrication areas while permitting the transfer of semiconductor wafers between the fabrication areas. A mass transfer system is positioned within each air lock chamber and allows for containerless transfer of wafers through the air lock chamber. The stock areas provide storage areas for containers adjacent to each air lock chamber. The robotic arms are used to move the containers between the stock areas and each air lock chamber. The control system governs the dispersal of containers and the operations of the air lock chambers, the mass transfer systems, the robotic arms, and the stock areas.
|
