发明名称 |
Photosensitive resin composition for sandblast resist |
摘要 |
Disclosed is a photosensitive resin composition suitable as a resist material against sandblasting for pattern-wise engraving of the surface of a body after photolithographic patterning, which comprises: (a) a urethane compound having a (meth)acrylate group at the molecular end, which is obtained from a polyether or polyester compound having a hydroxy group at the molecular chain end, a diisocyanate compound and a (meth)acrylate compound having a hydroxy group; (b) an alkali-soluble polymeric compound having an acid value in the range from 50 to 250 mg KOH/g; and (c) a photopolymerization initiator.
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申请公布号 |
US5924912(A) |
申请公布日期 |
1999.07.20 |
申请号 |
US19980018730 |
申请日期 |
1998.02.04 |
申请人 |
MATSUSHITA ELECTRONICS CORPORATION;TOKYO OHKA KOGYO CO., LTD. |
发明人 |
TAKEHANA, HIROSHI;YAMAMOTO, TETSUO;OBIYA, HIROYUKI;MIZUSAWA, RYUMA |
分类号 |
G03F7/004;B24C1/04;B24C3/32;C08F290/00;C08F299/06;G03F7/027;G03F7/032;G03F7/033;G03F7/035;G03F7/12;H01J9/02;H01J9/14;H05K3/04;(IPC1-7):B24B1/00 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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