发明名称 Method of forming semiconductor device
摘要 There is disclosed a manufacturing method of highly integrated circuits with thin-film transistors (TFTs) for use as peripheral driver circuitry in active-matrix liquid crystal display (LCD) panel with a pixel array each having a charge transfer control TFT, capable of facilitating formation of contact holes otherwise being difficult in cases where an anode oxide film is formed on gate electrodes of TFTs and lead wires both of which are made of anodizable metal, such as aluminum. The method includes execution of anodization while causing a resist mask to be disposed on part of the lead wire and electrode made of aluminum, thereby partly eliminating formation of the anode oxide film on the lead wire and electrode. At a later step of fabrication, each contact is formed by use of such portion that has no anode oxide film formed thereon. This may allow aluminum to be employed as lead wires while enabling easy fabrication of contacts therefor.
申请公布号 US5926735(A) 申请公布日期 1999.07.20
申请号 US19970802685 申请日期 1997.02.19
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD.;SHARP KABUSHIKI KAISHA 发明人 YAMAZAKI, SHUNPEI;YAMAGUCHI, NAOAKI;GOTO, YUUGO;TERAMOTO, SATOSHI;AWANE, KATUNOBU;YAMAMOTO, YOSHITAKA;HAMADA, TOSHIMASA
分类号 H01L21/28;H01L21/336;H01L21/768;H01L21/77;H01L21/84;(IPC1-7):H01L21/476 主分类号 H01L21/28
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