发明名称 Method for perforating heat sensitive stencil sheet
摘要 A method of perforating a heat-sensitive stencil sheet is provided which can give prints of high quality having sharp images high in density and free from seep through. This method comprises ejecting a photothermal conversion material contained in a liquid together with the liquid from a liquid ejector to transfer it in the form of dots onto a heat-sensitive stencil sheet, and then exposing the heat-sensitive stencil sheet to a visible or infrared ray to perforate the heat-sensitive stencil sheet specifically at portions to which the photothermal conversion material has been transferred, the dots satisfying the relation 3R>/=D>R in which R is diameter of the dot of the photothermal conversion material transferred and recorded onto the heat-sensitive stencil sheet and D is a pitch between adjacent dots. It is preferred that the heat-sensitive stencil sheet has a liquid absorbing layer on at least one side, and the liquid containing the photothermal conversion material is ejected onto the liquid absorbing layer. The liquid absorbing layer preferably has a contact angle with the liquid of 20-150 degrees. The liquid absorbing layer can be formed by appropriately mixing a hydrophilic resin and a water-repellent compound.
申请公布号 US5924361(A) 申请公布日期 1999.07.20
申请号 US19970872175 申请日期 1997.06.10
申请人 RISO KAGAKU CORPORATION 发明人 WATANABE, HIDEO
分类号 B41C1/14;B41N1/24;(IPC1-7):B41C1/14 主分类号 B41C1/14
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