发明名称 |
Microwave plasma processing method for preventing the production of etch residue |
摘要 |
A microwave plasma processing method capable of processing an object layer having a minute configuration and a laminated object layer without producing any etch residue and of increasing the ratio of the etching selectivity of the object layer to those of a mask and an underlying layer when etching a laminated film. To achieve this, the intensity of a magnetic field created by solenoids surrounding a plasma processing chamber is varied to vary the distance between the object surface of a workpiece and a flat resonance region for etching an object layer and for overetching the object layer to vary the position of a plasma produced by the interaction of an electric field created by a microwave and the magnetic field created by the solenoids according to the layers being processed.
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申请公布号 |
US5925265(A) |
申请公布日期 |
1999.07.20 |
申请号 |
US19950492887 |
申请日期 |
1995.06.20 |
申请人 |
HITACHI, LTD. |
发明人 |
WATANABE, KATSUYA;SATO, TAKASHI;HAIKATAK, ERI |
分类号 |
H05H1/46;B23K10/00;C23C14/40;C23F4/00;H01J37/32;H01L21/00;H01L21/302;H01L21/3065;(IPC1-7):B23K10/00 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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