发明名称 Cooling device for electronic component
摘要 A header tank for accommodating refrigerant is formed on one side of the cold plate, on the other side of which an electronic component is mounted. A plurality of loop pipes in which the refrigerant is circulated are connected with the header tank. The plurality of loop pipes are arranged substantially parallel with the cold plate. The radiating area of the loop pipes distant from the cold plate is larger than the radiating area of the loop pipes close to the cold plate.
申请公布号 US5924481(A) 申请公布日期 1999.07.20
申请号 US19960667805 申请日期 1996.06.20
申请人 CALSONIC CORPORATION 发明人 TAJIMA, MAKOTO
分类号 F28D15/02;H01L23/427;(IPC1-7):F28D15/00 主分类号 F28D15/02
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