Practical method to make blind vias in circuit boards and other substrates

摘要

A new method of preparing blind vias in printed circuit boards and other substrates allows for the drilling of holes for connection between conductive layers, in insulating layers prior to laminating insulating layers together. Each insulative layer is prepared with patterned conductive wiring and holes are drilled through the layer at points where wiring is to connect to another level of wiring. Two layers are aligned, using mechanical, optical, or other alignment mechanisms, and subsequently laminated together. The holes are plated with conductor after lamination to form an electrical connection. Additional layers can be added by the same method.