发明名称 Method and apparatus for the thermal management of electronic devices
摘要 An apparatus comprising an enclosure, a power supply circuit and a passive heat removal device is described. Specifically, the enclosure having a plurality of sides defines an air plenum wherein select ones of the plurality of sides have openings disposed therein with a fan disposed within a first of the openings. The power supply circuit, disposed within the enclosure, is operative to provide power to electronic components disposed outside of the enclosure, and to dissipate heat into the air plenum. The passive heat removal device, disposed along a first of said plurality of sides, is operative to transfer heat generated by one or more electronic devices thermally coupled to the outside of the enclosure into the air plenum for evacuation by the fan.
申请公布号 US5926367(A) 申请公布日期 1999.07.20
申请号 US19970987427 申请日期 1997.12.09
申请人 INTEL CORPORATION 发明人 GUTIERREZ, PAUL A.;HOLDEN, THOMAS T.
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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