| 摘要 |
FIELD: electronics, manufacture and test of semiconductor integrated microcircuits and structures. SUBSTANCE: in accordance with proposed process of manufacture and test of electron components assemblage of crystals is put into mould with orientation to bonding pads of crystals and base elements of mould, all unprotected surfaces of crystals except bonding pads are insulated. Specific feature of process lies in that crystals located in mould are interfixed with formation of group carrier with provision of arrangement of face surfaces of crystals in one plane with one of surfaces of group carrier. All conductors necessary for electric thermal training and test and outer connector of carrier are simultaneously deposited on this plane. Group metal frame is placed together with crystals into mould, frame is fixed together with crystals. Group carrier can also be formed by flexible printed circuit linked to rigid base. EFFECT: reduced cost of processes of electric thermal training and finishing test, decreased duration of technological process of assembly and test of electronic components. 11 cl, 12 dwg |
