| 摘要 |
PURPOSE:To reduce a resin pressure acting to an IC chip in the resin molding of the IC chip. CONSTITUTION:In a mold 2 in use, an injection port 3 is provided on the upper surface of a cavity 1 at approximately the center thereof, a riser 4 is provided on the lower surface at the peripheral edge part thereof, and a cylindrical partition wall 5 is provided on the lower surface at the center thereof so as to be projected to or retracted from the center of the cavity 1. In the cavity 1, a lead frame 7 is horizontally disposed with an IC chip 6 showing down. Furthermore, in the state that the IC chip 6 and a wire 8 is surrounded by the partition wall 5, firstly a melt resin 9 is injected from the injection port 3. When the melt resin 9 is almost fully charged into the cavity 1 and also led into the riser 4, the injection port 3 is closed. Thereafter, the melt resin 9 in the riser 4 is pressed back into the cavity 1, and simultaneously the partition wall 5 is retracted from the inside of the cavity 1. |
