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发明名称
SEMICONDUCTOR WIRE BONDING APPARATUS
摘要
申请公布号
KR200150930(Y1)
申请公布日期
1999.07.15
申请号
KR19960019296U
申请日期
1996.06.29
申请人
HYUNDAI ELECTRONICS IND. CO., LTD
发明人
PARK, MYUNG-GOON
分类号
H01L21/60;(IPC1-7):H01L21/60
主分类号
H01L21/60
代理机构
代理人
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地址
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