| 发明名称 |
IC CARD AND METHOD FOR MANUFACTURE OF THE SAME |
| 摘要 |
An IC card and a method of fabricating the same are provided in which the IC card substrate is formed of a blackened metal core plate to improve thermal, electrical and mechanical stability of the IC card. |
| 申请公布号 |
KR100209259(B1) |
申请公布日期 |
1999.07.15 |
| 申请号 |
KR19960012945 |
申请日期 |
1996.04.25 |
| 申请人 |
SAMSUNG AEROSPACE INDUSTRIES, LTD. |
发明人 |
RYU, JAE-CHUL |
| 分类号 |
B42D15/10;G06K19/077;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
B42D15/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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