发明名称 HEATED FLOOR SYSTEM AND METHOD
摘要 <p>A heated floorboard includes a floorboard body (2) made of a thermal and electrical isolator material and shaped so that a plurality of the floorboards, when assembled one adjacent to the other, form a heated floor. An electrical heater (7) is located in the upper part of the floor body (2). Electrical contacts (73) are located on the floorboard body (2) and connect the ends of the heater (7) to an electrical bus (3). A latch pair (29) mounted near one end of the floorboard (2) is mechanically attached to an electrical bus (3), and snaps on the hole pair (39) to secure the floorboard (2) to the electrical bus (3). Additional hole pairs (392, 393, 394) in an electrical bus (3) serve to attach to other floorboards.</p>
申请公布号 WO1999035887(A1) 申请公布日期 1999.07.15
申请号 IL1998000007 申请日期 1998.01.07
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