| 摘要 |
<p>A probe assembly (50), which includes a probe (52) and a controller (54), is provided for semiconductor wafer polishing and similar wafer treatments. The polishing table (32) is divided into two parts (32a and 32b) to form an annular recess (42) for receiving the probe (52), with the probe free end located to view interior portions of a semiconductor wafer temporarily passing over the recess. Probe data may conveniently be used for polishing end point determination.</p> |
