<p>The socket includes a socket case (1) which can be soldered to the circuit board by a reflow process. An opening is provided in the base of the case, through which the bent connector ends of the signal contacts of an insulating block extend to the corresponding conductor tracks on the circuit board, where they are soldered as SMT contacts.</p>
申请公布号
DE19736607(C1)
申请公布日期
1999.07.15
申请号
DE1997136607
申请日期
1997.08.22
申请人
OTTO DUNKEL GMBH FABRIK FUER ELEKTROTECHNISCHE GERAETE, 84453 MUEHLDORF, DE
发明人
JANKOWSKY, MEINRAD, 84513 TOEGING, DE;OBERSTARR, REINHARD, 84570 POLLING, DE
