| 摘要 |
<p>A semiconductor socket converter module having a simplified low-cost structure composed of a plurality of circuit boards of high connection reliability and adapted for replacement of I/O terminals, for example, to upgrade a semiconductor package on a motherboard. The module structure comprises a first circuit board provided with replacement connection circuits and having conductor pins for external connections on its lower side, a second circuit board carrying a semiconductor package on its upper side and having I/O terminals projecting downward and corresponding to the conductor pins for external connections, and a daughter board interposed between the first and second circuit boards and having conductor patterns connected with the replacement connection circuit and with particular ones of the I/O pins, the conductor pins for external connections being connected electrically with the particular I/O pins through the replacement connection circuit.</p> |
