COOLING DEVICE AND METHOD FOR MULTI CHIP MODULE

摘要

The multi chip module cooling apparatus of the present invention includes a cold plate having a sealed housing formed with a first side member, a second side member and an interior space, and a metal block having a refrigerant vapor flow passage and a cooling water flow passage formed in opposite to the refrigerant vapor flow passage so as to condense the refrigerant vapor discharged from the housing by using a cooling water flowed in the cooling water passage. A pair of circulating tubes connect the cold plate and the block as a circulation loop shape, the circulating tubes are consisted of a refrigerant vapor flow tube for discharging a hot refrigerant vapor from the housing of the cold plate to the refrigerant vapor flow passage in the blocks and a refrigerant flow tube for supplying a refrigerant condensed in the block to the housing of the cold plate. Thermosyphon action due to boiling of the refrigerant in the vertical channel of the cold plate eliminate the significant temperature rise at the multi chip module, which occurs in the horizontal channel in the cold plate.