Integrated electro-optical package

摘要

An integrated electro-optical package (50) including an optically transparent substrate (10) with a large array (20) of light emitting devices (12) formed thereon and cooperating to generate a complete real image. The light emitting devices (12) are positioned in rows and columns and connected to pads (33) adjacent outer edges of the substrate (10). A driver substrate (55) having mounting pads, bump bonded (58) to the pads (33) on the substrate (10). A plurality of driver circuits (57) connected to the light emitting devices (12) through terminals on the driver substrate (55). A lens (60) mounted to the substrate (10) over the array (20) of light emitting devices (12) and on a side opposite to magnify the real image and produce an easily viewable virtual image.