发明名称 |
COMPONENT MOUNTING BOARD, PROCESS FOR PRODUCING THE BOARD, AND PROCESS FOR PRODUCING THE MODULE |
摘要 |
Characterized in that a mask film (3) having desired openings (2) are coated onto a metal wiring plate (1). According to this, an insulating base body and a resist layer making a thick base as in a conventional substrate can be omitted. In addition, by bending a terminal part (T) of the metal wiring plate (1), a connecting terminal replaceable with a connecter terminal to another substrate can be also machined integrally and the connecter terminal can be made unnecessary, so that an inexpensive parts-packaging substrate can be provided. <IMAGE> |
申请公布号 |
EP0835046(A4) |
申请公布日期 |
1999.07.14 |
申请号 |
EP19970914624 |
申请日期 |
1997.04.07 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KUMAGAI, KOICHI;WADA, YOSHINORI;EDAHIRO, TERUKI |
分类号 |
H05K1/00;H05K3/20;H05K3/28;H05K3/34;(IPC1-7):H05K1/02;H05K3/04 |
主分类号 |
H05K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|