发明名称 Heavy-current flowing circuit substrate, a method for producing the heavy-current flowing circuit substrate, and an assembled unit of a heavy-current flowing circuit substrate and a printed circuit substrate
摘要 A heavy-current flowing circuit substrate 1 comprises a resin-molded body 2 in which a plurality of bus bars 4 made of an elongated metallic plate 3 are embedded and both ends of each of the bus bars 4 are projected from the resin-molded body 2 so as to use them as connecting terminals, the heavy-current flowing circuit substrate 1 being attached or formed integrally with at least one printed circuit substrate 12 mounting thereon electronic devices 13. <IMAGE>
申请公布号 EP0929123(A1) 申请公布日期 1999.07.14
申请号 EP19980110685 申请日期 1998.06.10
申请人 MOLDEC CO., LTD. 发明人 TAKEUCHI, SHINOBU
分类号 H01B7/00;H01B13/00;H01R9/22;H05K1/00;H05K1/02;H05K3/20;H05K3/40 主分类号 H01B7/00
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