发明名称 |
Heavy-current flowing circuit substrate, a method for producing the heavy-current flowing circuit substrate, and an assembled unit of a heavy-current flowing circuit substrate and a printed circuit substrate |
摘要 |
A heavy-current flowing circuit substrate 1 comprises a resin-molded body 2 in which a plurality of bus bars 4 made of an elongated metallic plate 3 are embedded and both ends of each of the bus bars 4 are projected from the resin-molded body 2 so as to use them as connecting terminals, the heavy-current flowing circuit substrate 1 being attached or formed integrally with at least one printed circuit substrate 12 mounting thereon electronic devices 13. <IMAGE> |
申请公布号 |
EP0929123(A1) |
申请公布日期 |
1999.07.14 |
申请号 |
EP19980110685 |
申请日期 |
1998.06.10 |
申请人 |
MOLDEC CO., LTD. |
发明人 |
TAKEUCHI, SHINOBU |
分类号 |
H01B7/00;H01B13/00;H01R9/22;H05K1/00;H05K1/02;H05K3/20;H05K3/40 |
主分类号 |
H01B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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