发明名称 Method for forming a capacitive element connected in a circuit with a power device, and circuit formed in this way
摘要 <p>A description is given of a method for forming a capacitance electrically connected to a first power device having an exposed metal part, characterized in that a dielectric material (33) is placed between an exposed metal portion (21) of said first power device (7) and another point of an electronic circuit in which said first power device is connected, for example the exposed metal portion (23) of a second power device. The metal portions form part of the plates of said capacitance. &lt;IMAGE&gt;</p>
申请公布号 EP0929142(A2) 申请公布日期 1999.07.14
申请号 EP19980830720 申请日期 1998.12.02
申请人 MAGNETEK S.P.A. 发明人 CANOVA, ANTONIO;MARTINI, DAVID;BRACCINI, ROBERTO
分类号 H02M1/00;(IPC1-7):H02M1/00;H01G1/005;H01G1/14;H01G4/40 主分类号 H02M1/00
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