发明名称 |
Electronic device assembly |
摘要 |
An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.
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申请公布号 |
US5923535(A) |
申请公布日期 |
1999.07.13 |
申请号 |
US19970959270 |
申请日期 |
1997.10.28 |
申请人 |
NEC CORPORATION |
发明人 |
SHIMADA, YUZO;SUYAMA, TAKAYUKI;HASEGAWA, SHINICHI |
分类号 |
H01L23/498;H05K1/14;H05K3/00;H05K3/34;H05K3/36;(IPC1-7):H05K1/03 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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