摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a printed circuit board at low cost by directly connecting a package to the printed circuit board so that they cannot be released, and by connecting a connection leg of a memory module to the printed circuit board, so that they can be released when the memory module is mounted into the package as a chip or is casted. SOLUTION: In a memory module RAM of a printed circuit board P with a microprocessor module MP and a number of memory module RAMs, the chip is mounted to the printed circuit board P in a package Pck through a connection that cannot be released. In this case, the printed circuit board P is provided with the memory module RAM and a socket Conn for accommodating another memory module RAM 1 if required. The memory module RAM 1 is mounted etachably to the socket Conn through, for example, a plug. Only the standard process of manufacture is required, thus inexpensively manufacturing the printed circuit board.</p> |