发明名称 Cascading transistor gate and method for fabricating the same
摘要 A cascading transistor gate structure and method for fabricating the same are disclosed. A substrate is provided, and a layer of gate dielectric material is formed over the substrate. A layer of electrically conductive material is formed over the gate dielectric. A layer of hard mask material is formed on the layer of electrically conductive material. A photoresist mask is used to pattern the layer of hard mask material to form a hard mask. A layer of spacer material is deposited over the existing structures, and the layer of spacer material is etched to form a pair of spacers adjacent to the hard mask. The hard mask is removed, leaving the spacers. The layer of electrically conductive material is etched in alignment with the spacers. The spacers are then removed, revealing two transistor gates. A conductive region in formed in the substrate between the two gates. The two gates operate in tandem, yielding a cascading gate with an effective length that is the lengths of the two gates combined.
申请公布号 US5923981(A) 申请公布日期 1999.07.13
申请号 US19960777600 申请日期 1996.12.31
申请人 INTEL CORPORATION 发明人 QIAN, QI-DE
分类号 H01L21/28;H01L21/336;H01L21/84;H01L29/78;H01L29/786;(IPC1-7):H01L21/336 主分类号 H01L21/28
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