| 摘要 |
PROBLEM TO BE SOLVED: To obtain an insulating adhesive capable of keeping a membrane thickness of an adhesive layer to a constant value and accomplishing the stress relaxation at the adhesive layer in a semiconductor chip or the like. SOLUTION: This insulating adhesive consists essentially of (A) a thermoset resin composition comprising (a) a thermoset resin, (b) a hardener and (c) a insulating powder having maximum particle diameter not larger than the maximum particle diameter of hard plastic fine particles, and (B) the hard plastic fine particles not melted under the hardening heating condition of the thermoset resin composition and having particle diameters substantially regulating the membrane thickness of the adhesive layer after hardened, and is obtained by compounding 0.01-1 pt.wt. component B with 100 pts.wt. component A. Especially, the plastic of the hard plastic particles B is preferably a vinylic polymer obtained by polymerizing monomers including divinylbenzene. |
