| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively constitute interior substrate structure without providing a moisture-proof layer in the intermediate part by adhering and laminating an interior face material and a heat insulator by a non-permeable wet adhesive to constitute the interior substrate structure. SOLUTION: A face-like heat insulator 14 composed of a synthetic resin foaming body through a non-permeable wet adhesive layer 12 is adhered and laminated on the rear face of an interior face material 10 composed of a plaster board or the like. An applying amount of the non-permeable wet adhesive is 100 g/m<2> or more, preferably 130 g/m<2> or more, film thickness is 30μm or more and a degree of water vapor permeability is 30 g/m<2> .24 H or less. Thus, indoor humidity invades a wall face inside to prevent dew condensation and volatile organic compound can be prevented from entering a room inside. Interior substrate structure can be inexpensively manufactured without any need for existing a moisture-proof layer between the interior face material 10 and a face-like heat insulator 14.
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