| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which is improved in effective space factor when packaged, as well as lead terminals are prevented from falling off. SOLUTION: In this method, at least islands 33 and a lead frame 30 possessed of lead terminals 34 are prepared. The lead terminals 34 are held through recesses. Semiconductor chips 39 are mounted, connected, and molded up with resin 41 in common. The backside of the molded resin 41 is partly removed to make a metal surface exposed, and the exposed metal surfaces are to serve as outer connection electrodes. The semiconductor chips 39 are divided into individual pieces, by cutting the molded resin 41 along the centers of recesses each provided to the lead terminals 34. |
