| 摘要 |
PROBLEM TO BE SOLVED: To achieve a compact configuration of an LSI chip at least in the longitudinal direction. SOLUTION: This device has an LSI chip 5 which has a plurality of bonding pads 1 and a plurality of leads having specified inclined parts, which are arranged in the longitudinal direction of this LSI chip at least at inner leads 7, respectively. The bonding pads 1 are arranged in a single line at the center of the LSI chip 5. The cnstitution is such that the tilt angle at the inclined part of the respective lead 7 becomes larger, when the lead 7 is arranged more closer to the end part of the LSI chip. Desirably, the width of the inner lead 7 is narrowed in a direction towards the bonding pad 1. |
