| 摘要 |
PROBLEM TO BE SOLVED: To enable the use of a thick inexpensive inspection probe in the inspecting process of a tape carrier and the inspecting process of a semiconductor element assembly and to improve the manufacturing yield rate of a semiconductor device. SOLUTION: This device has a tape-shaped substrate 1, wherein a plurality of semiconductor elements are mounted and aligned in the longitudinal direction at the central part, and first and second patterns 10 and 20 which are taken out in the width direction from the central part of the substrate 1. In respective patterns 10 and 20, a plurality of wirings 11 and 21, which have a bonding part with the semiconductor elements, the outer terminal part connected to the bonding part and the drawing part which is withdrawn out to the outer terminal part, are aligned and constituted. In this case, the wiring 11 is constituted of a plurality of cables. The tip part of the drawing part of the wiring 11 of each group is arranged in a specified pattern. |
