| 摘要 |
PROBLEM TO BE SOLVED: To realize the increasing and miniaturization of pins in a semiconductor device. SOLUTION: This device consists of a tab 1a loaded with a semiconductor chip 2, a plurality of inner leads 1b provided extensively around the tab 1a and electrically connected through the intermediary of the semiconductor chip 2 and a bonding wire 4, a resin main body part 3 formed by resin encapsulating the semiconductor chip 2 as well as a lead reinforcement part 6 for fixing a plurality of outer leads 1c which connects to the inner leads 1b, protruding from the resin main body part 3 and a front end 1d of the respective outer leads 1c which protrude from the resin main body part 3 through resin formation, and are provided between the resin main body part 3 through the intermediary of a cavity part 5. Here, the lead reinforcing part 6 and the resin main body part 3 are formed integrally by an encapsulating resin 7. |
