| 摘要 |
PROBLEM TO BE SOLVED: To fix the amount of rise of a tool from a reference bond position by setting the height position of the tool when bonding a first wire to a reference bond position, and by moving the tool according to a travel amount being stored at a storage part in advance by using the reference bond position as a reference when looping a remaining wire. SOLUTION: A tool 10 is lowered, a sinking height position S1 when a first wire is bonded to a bond point P1 is detected by a bond position detection sensor, the sinking height position S1 is read as a reference bond position S1 and is stored at a storage part. Then, after the bonding to the bond point P1 is completed, the reference bond position S1 is used as a reference, a rising position C1 and a rising amount ΔH1 are calculated at a height position operation processing part based on a looping parameter being stored at the storage part in advance, the rising position C1 is positioned according to the calculation, and the tool 10 is moved to a second bond point. |
