发明名称 |
Method and apparatus for cooling integrated circuits using a thermoelectric module |
摘要 |
An integrated circuit cooling device in which a thermoelectric module (TEM) is built into a printed circuit board (PCB) so that the TEM converts heat generated by an integrated circuit on the PCB into DC power that is then supplied to a DC-DC regulator to drive a cooling fan. In one embodiment, the cooling fan is incorporated within a heat sink disposed on one side of the PCB so that the built-in TEM is between the heat sink and the integrated circuit being cooled. In an alternate embodiment, the cooling fan is located remotely from the heat sink.
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申请公布号 |
US5921087(A) |
申请公布日期 |
1999.07.13 |
申请号 |
US19970844769 |
申请日期 |
1997.04.22 |
申请人 |
INTEL CORPORATION |
发明人 |
BHATIA, RAKESH;PADILLA, ROBERT D.;HERMERDING, II, JAMES G. |
分类号 |
F25B21/02;H01L23/38;H01L35/30;H05K1/02;H05K1/18;(IPC1-7):F25B21/02;F28F7/00;H01L35/28 |
主分类号 |
F25B21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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