| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which can eliminate a conveying error, by improving the delivering accuracy of a polishing object between a delivering device and a top ring or a robot hand. SOLUTION: A top ring 4 to hold a semiconductor wafer; a turntable 2 having a grinding surface to grind the surface of the wafer held to the top ring 4; and a pusher 10 set at the position to deliver the semiconductor wafer to the top ring 4; are provided, and the pusher 10 is provided with a stage 11 having the supporting surface to load the semiconductor wafer; an air cylinder 15 to move the stage 11 up and down; and a guide member 12 positioning at the outer peripheral side of the stage 11, and having a reverse conical form of guide surface 12c to carry out the centering of the semiconductor wafer. |
