发明名称 WIRE MATERIAL FITTING STRUCTURE FOR CONDUCTOR
摘要 PROBLEM TO BE SOLVED: To positively connect wire material to various conductors by dividing a conductor formed on a board into a plurality of parts, and connecting the respective divided parts of the same potential and/or like poles with a single wire material. SOLUTION: A pair of electrodes 4, 5 are formed with a specified space on the surface 3a of a dielectric 3, and lead wires 6, 7 to be inserted in a printed circuit board are solder-jointed thereto. A pair of electrodes 4, 5 are respectively bisected almost at the center, so as to be composed of divided electrode parts 4A, 4B, 5A, 5B. The tip side parts 4A, 5B out of these divided electrode parts 4A-5B are of almost rectangular shape, while protrusions 4C, 5C extended towards the opposed piece side are formed at the base end side parts 4B, 5B. Tip parts 6a, 7a of the lead wires 6, 7 are solder-jointed to the tip side divided parts 4A, 5A, and intermediate parts 6b, 7b of the lead wires 6, 7 are solder- jointed to the base end side divided parts 4B. 5B.
申请公布号 JPH11191448(A) 申请公布日期 1999.07.13
申请号 JP19970359116 申请日期 1997.12.26
申请人 FUNAI ELECTRIC CO LTD 发明人 YAMANISHI YOSHIHIRO
分类号 H05K1/18;H05K3/34 主分类号 H05K1/18
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