摘要 |
PROBLEM TO BE SOLVED: To provide a target for sputtering capable of inexpensively and easily retaining the cooling effect of a target and improved in the utilizing efficiency. SOLUTION: As a target for DC sputtering, a material for target whose back face is not bonded with a cooling sheet of copper or the like is used, and into the space between it and a backing plate for cooling, the one obtd. by forming insulated coating of 1 to 50μm thickness on the surface of copper, aluminum or the alloy thereof is inserted, by which the target for sputtering capable of using till sputtering erosion reaches the metal or alloy applied with the surface coating is obtd.
|