| 摘要 |
PROBLEM TO BE SOLVED: To prevent the defective connection of a chip electrode and a bump. SOLUTION: This device has a TAB tape 2, on one surface of which a wiring 2a having an intended pattern, and a semiconductor chip 1 which is provided on the other surface has a chip electrode 4. The wiring 2a and the chip 4 are connected electrically via bumps 5 and 6 formed in a through-hole. Then, the semiconductor chip 1 has the two or more chip electrodes 4, which are connected to a wiring layer 3. The wiring 3 is connected to the chip electrodes 4 via the bumps 5 and 6, which are provided to face opposite the two or more chip electrodes 4, respectively.
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