发明名称 Automatic reflow soldering apparatus
摘要 A transport mechanism for printed circuit boards is comprised of two endless drive members, movable carriers installed between these two drive members and one pair of parallel guide rails to support the carriers while moving in a horizontal state. The drive members extend diagonally between horizontal upper and lower runs on both ends of the mechanism. The carriers are installed at fixed intervals along the length of the drive members. The carriers are also provided with a roller member on both sides of the carrier to run on the upper part of the guide rail. The guide rail is further installed diagonally along the diagonal portion of the drive members at fixed intervals in order to support the carrier horizontally while in a diagonal state of movement.
申请公布号 US5922230(A) 申请公布日期 1999.07.13
申请号 US19970806910 申请日期 1997.02.26
申请人 EIGHTECH TECTRON CO., LTD. 发明人 YOKOTA, YATSUHARU
分类号 H01R13/42;B23K1/008;B65G17/12;F27B9/24;F27D3/12;(IPC1-7):F27B9/24;B23K32/02;B65G37/00 主分类号 H01R13/42
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