| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject paste capable of manifesting excellent low stress, adhesion and rapid hardening properties and useful for semiconductor bonding by including a combination of a specific acrylate with a specific silane coupling agent as essential components. SOLUTION: This paste consists essentially of (A) a urethane diacrylate obtained by reacting a hydroxyalkylacrylic acid, a polyalkylene glycol with diisocyanate, (B) a monoacrylate of formula I (R1 is a >=10C substituent group containing an alicyclic group and/or an aromatic group), (C) a (meth)acrylate of formulas II [(a) is O or 1; (b) is 1 or 2 and (c) is 1 or 2 with the proviso that (b)+(c)=3] or III, (D) an aliphatic epoxy-containing alkoxysilane, (E) an organic peroxide and/or an azo compound and (F) an inorganic filler. The weight ratio of the components A to B is preferably (80/20)-(20/80) and the ratio of the components C/D (in composition ratio) is preferably 0.1-10. |
