发明名称 Surface acoustic wave device with an electrode insulating film and method for fabricating the same
摘要 PCT No. PCT/JP95/01554 Sec. 371 Date Sep. 13, 1996 Sec. 102(e) Date Sep. 13, 1996 PCT Filed Aug. 4, 1995 PCT Pub. No. WO96/04713 PCT Pub. Date Feb. 15, 1996In a surface acoustic wave device for processing signals of relatively high frequencies, as of above 1 GHz, by the use of surface acoustic waves which propagate on the surface of a piezoelectric substrate, radiating bulk waves in the direction of depth of the piezoelectric substrate, an IDT structure is provided, which does not increase propagation loss and has sufficiently low electric resistance. The device comprises a piezoelectric substrate 10, and an electrode of a conducting film 12 for exciting, receiving, reflecting and/or propagating surface acoustic waves, and the surface acoustic waves propagate on the surface of the piezoelectric substrate, radiating at least one transverse component of bulk waves in the direction of depth of the piezoelectric substrate 10. An insulating film 18 has different thicknesses between first regions in the electrode, where the conducting film 12 is present, and second regions in the electrode, where the conducting film 12 is absent so that acoustic impedances of the first and the second regions with respect to the surface acoustic waves are substantially equal to each other.
申请公布号 US5923231(A) 申请公布日期 1999.07.13
申请号 US19960666447 申请日期 1996.09.13
申请人 KINSEKI LIMITED 发明人 OHKUBO, YUKIO;SATO, TAKAHIRO
分类号 H03H9/02;H03H9/145;H03H9/25;(IPC1-7):H03H9/145;H03H9/64 主分类号 H03H9/02
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