发明名称 Integrated circuit having local interconnect for reducing signal cross coupled noise
摘要 An integrated circuit is provided having an improved interconnect structure. The interconnect structure includes a power-coupled local interconnect which is always retained at VDD or VSS (i.e., ground) level. The local interconnect resides a dielectric-spaced distance below critical runs of overlying interconnect. The powered local interconnect serves to sink noise transients from the critical conductors to ensure that circuits connected to the conductors do not inoperably function. Accordingly, the local interconnect extends along a substantial portion of the conductor length, and is either wider or narrower than the conductor under which it extends. The local interconnect can either be polysilicon, doped polysilicon, polycide, refractory metal silicide, or multi-level refractory metal.
申请公布号 US5924008(A) 申请公布日期 1999.07.13
申请号 US19970942248 申请日期 1997.10.01
申请人 ADVANCED MICRO DEVICES, INC. 发明人 MICHAEL, MARK W.;DAWSON, ROBERT;BANDYOPADHYAY, BASAB;FULFORD, JR., H. JIM;HAUSE, FRED N.;BRENNAN, WILLIAM S.
分类号 H01L21/768;H01L23/522;H01L23/528;H01L27/11;(IPC1-7):H01L21/476 主分类号 H01L21/768
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