摘要 |
<p>PROBLEM TO BE SOLVED: To prevent attachment of dust or the like on a wafer substrate, when a cover is opened. SOLUTION: This semiconductor clean box comprise a box body 1 and a cover and a constitution, such that a plurality of wafer substrates 3 are overlapped and contained in the box body 1 under the state in which a space is provided, the cover is attached to the front surface of the box body 1, and the sealed state is maintained. Furthermore, at a back surface 1B of the box body 1, a gas blow-out mechanism, for blowing out a gas into the box body 1 at the required time, is provided.</p> |