| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package airtight sealing metallic lid capable of highly reliable airtight seal. SOLUTION: A semiconductor package airtight sealing metallic lid on which a metallic plate is clad with a solder layer 22 to be drawing-molded into a cap shape with the solder layer 22 lined inside is furthermore constituted of a flat top face part, an inclined side face part 18 is provided continuously around the flat top part and an edge face part 20 to encircle the lower end part of the side face part 18. Relations H>=L, 5 deg.<=θ<=20 deg. is satisfied. In this lid 10, L, H,θare respectively the width of the edge face part 20, the height of the top face part, and the inclination angle of the side face part 18.
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