发明名称 HIGH FLATNESS MATERIAL MANUFACTURING DEVICE AND ITS TEMPERATURE CONTROL METHOD
摘要 PROBLEM TO BE SOLVED: To improve the stability of the operation and the yield in a lapping process to carry out a precise plain surface processing. SOLUTION: To at least one side of the upper and the lower surface plates 1 and 2, spare heating bodies 10 housing temperature detectors 16 are provided at the surface plate receivers 17 and 18 side at the opposite side surfaces from the processing operation surfaces of the surface plates, and a box 7 to cover the part lower than the process operating surface of the surface plates, is provided. While a circumstance temperature detector 16; the lower surface plate 2; a spare heating body housing the temperature detector at the lower surface plate; a motor 8; and a speed reduction mechine 9; are housed in the box 7, an exhaust system device which consists of a duct 12 for exhaust; a damper 14; and an exhaust fan 13; is provided at the side surface of the box 7, so as to obtain a high flatness material manufacturing device furnished with a control mechanism 15 to control the spare heating body housing a temperature detector, and the exhaust system device; and a method to control the process operation surface of the lapping surface plate of the high flatness material manufacturing device.
申请公布号 JPH11188613(A) 申请公布日期 1999.07.13
申请号 JP19970357795 申请日期 1997.12.25
申请人 SPEEDFAM CO LTD;MITSUBISHI MATERIALS SILICON CORP 发明人 KIYONO TOSHIHIRO;KAWAI SHINICHI
分类号 B24B49/14;B24B37/015 主分类号 B24B49/14
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