Covered wire connection structure

摘要

Two covered wires conductively connected with each other are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. Cover portions are melted and pressurized from the outside of resin chips capable of obtaining a sealing condition and providing an excellent melting operation efficiency so as to connect conductive wire portions conductively at the connection portions. Then, the pair of the resin chips are melted together to seal the connection portions. In introducing end portions in which a covered wire is introduced out of the resin chips, between a melting surface relative to a mating resin chip and an outer peripheral surface, a round corner having a curvature continuously changing smoothly is provided. Thus, it is possible to obtain a sealing condition securely and an excellent melting operation efficiency.