| 摘要 |
PROBLEM TO BE SOLVED: To provide a photomask pattern defect analysis apparatus and method capable of analyzing the cause for the occurrence of abnormality, etc., in a production process by accumulating the detailed information of defects as well as a recording medium recorded with a photomask defect analysis program. SOLUTION: The image data of the defective part detected by a defect observation inspection section 1 is converted to bit map image data in an image input section 2 and thereafter, the defective part is recognized in an image processing section 3. The area, shape, size, kind, etc., of the recognized defective part are decided in a defect deciding section 4. The result of the decision is accumulated as the defect information in a defect information data base 5. The characteristics, cause for the occurrence, etc., of the detected defective part are analyzed in a data analysis section 6 in accordance with the defect information obtd. by the defect deciding section 4 and the defect information accumulated in the defect information data base 5. The result of the analysis is outputted from a data output section 7. |
