| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wafer accommodating tube suitable for transferring a wafer, by constituting the wafer accommodating tube of material having thermal resistance and light transparency, accommodating a quartz jig for mounting a wafer, forming a notched slit for carrying in and out the wafer, and making the inner and the outer diameters equal to those of a reacting tube of a chemical vapor deposition equipment. SOLUTION: In this wafer transferring method, the following are used; a wafer accommodating tube 1 which has inner and outer diameters almost equal to those of a reacting tube 10 of a chemical vapor deposition(CVD) equipment, has slit 3 for carrying in and out a wafer, and is constituted of transparent Pyrex pipe, a jig 2 which is composed of quartz and mounts the wafer, a gas jetting jig 6 always jetting clean inert gas (nitrogen gas, helium gas, argon gas, etc.), against the vicinity of the slit 3, and a vacuum tweezers for clamping the wafer. When the wafer is loaded in the CVD equipment, the wafer accommodating tube is arranged on the axis identical to the axis of the reacting tube of the CVD equipment, and inert gas is jetted against the periphery of the slit by using the gas jetting jig. |
