SEMICONDUCTOR PACKAGE AND ITS MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package wherein, even when semiconductor packages of the same structure are laminated for mounting, specified terminals or the IC connected in the packages are separately inputted/outputted. SOLUTION: Rear surface terminals 14a-14g provided at a package main body 11 of a resin sealing a memory IC16, and surface terminals 12a and 12g are provided. The rear surface terminals 14a and 14b are electrically connected, as pair, to the surface terminals 12a and 12b through the memory IC18 to constitute a first signal circuit, the rear surface terminal 14d is electrically connected, as pair, to the surface terminal 12c with no memory IC16 inbetween to constitute a second signal circuit, and the rear surface terminal 14c except for the first and second signal circuits is electrically connected to the memory IC16 to constitute a third signal circuit.